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    MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit

    • Electronic potting and encapsulating compound for printed circuit boards. It insulates AC/DC high and low voltage. It bonds to ABS PVC plastic housing, wire jackets, mold injected components, powder coated and metal substrates. This non-electrically conductive epoxy resin is for waterproofing and embedding electronic components. It is opaque black for permanent masking. It cures at room temperature with a 2:1 mix ratio and a medium setting. It cures to a very rigid state, with an operating temperature up to 190°F (90°C)
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    Electronic potting and encapsulating compound for printed circuit boards. It insulates AC/DC high and low voltage. It bonds to ABS PVC plastic housing, wire jackets, mold injected components, powder coated and metal substrates. This non-electrically conductive epoxy resin is for waterproofing and embedding electronic components. It is opaque black for permanent masking. It cures at room temperature with a 2:1 mix ratio and a medium setting. It cures to a very rigid state, with an operating temperature up to 190°F (90°C)

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