the PTM7950 thermal pad is a highthermalconductivity PhaseChange Material (PCM). It offers longer service life and better performance compared with traditional thermal pads
2 Pack, 20×30×0.25mm. Phasechange temp: 45°C. Thermal conductivity: 8.5W/m·K. Normal melting at high temperatures; resolidifies when cooled. Delivers great heat dissipation through repeated meltsolidify cycles Note: Requires proper installation skills. Professional guidance recommended. Chill in the refrigerator for easier film peeling
PTM7950 is a proprietary material that delivers longterm reliability while maintaining low thermal impedance (<0.04°C·cm²/W @ no shim). This makes the PTM7950 series ideal for highperformance integratedcircuit devices
The 20x30mm PTM7950 Thermal Pad is engineered to minimize interfacial thermal resistance, sustain outstanding performance, and enable scalable deployment at competitive cost
Any questions? Our AI mode will help you find out quickly.
Try me now
PTM7950, a high thermal conductive Phase Change Material (PCM) in pad format, was designed to minimize thermal resistance at interfaces and has the great excellent long term reliability.
Based on a novel polymer PCM system, this material exhibits excellent wetting at interfaces during typical operating temperature range, resulting in very low surface contact resistance.
A proprietary filler material provides high thermal conductivity 8.5W/m ·K and a low thermal impedance (<0.04°C cm²/W), suitable for high performance IC devices.
PTM7950, a high thermal conductive Phase Change Material (PCM) in pad format, was designed to minimize thermal resistance at interfaces and has the great excellent long term reliability.
Based on a novel polymer PCM system, this material exhibits excellent wetting at interfaces during typical operating temperature range, resulting in very low surface contact resistance.
A proprietary filler material provides high thermal conductivity 8.5W/m ·K and a low thermal impedance (<0.04°C cm²/W), suitable for high performance IC devices.
