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Main image of UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling

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UTP-8 Thermal Putty,Cooling Pad for Electronic Devices (20, Grams) | Moldable Thermal Putty, Non-Conductive, Replacement for Soft Thermal Pads Up To 3mm for GPU VGA IC Chip Cooling

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NOT SUITABLE FOR CPU: 14.8 W/mK highconductivity thermal putty, works as replacement for soft thermal pads, fills gaps for GPU, VGA and memory IC chips.
NONCONDUCTIVE & SAFE: Halogenfree and RoHS compliant formula prevents shortcircuit risk, delivers stable performance under hightemperature working conditions.
LOW VISCOSITY & MOLDABLE: Tacky flexible texture fits uneven surfaces. Supports autodispensing equipment and stencil screenprinting application scenarios.
NO DRYOUT PERFORMANCE: Fully cured thermal material will not dry out over time, great for electronic assembly, rework and field repair projects.
GAPFILLING COSTSAVER: Compresses well to fill gaps compared with rigid thermal pads, practical for PC modders and electronics maintenance technicians.

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UTP8 Moldable Thermal Putty is RoHS compliant halogenfree gapfilling thermal material, NOT intended for CPU use. 14.8W/mK thermal performance replaces traditional thermal pads for GPU, VGA and memory IC chips. Lowviscosity tacky texture supports manual or autodispensing installation. It will not dry out, ideal for electronic assembly, rework and field repair.

Additional Information
First Listed on Newegg	September 29, 2026

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Return for refund within: 30 days
Return for replacement within: 30 days
This item is covered by Aenyutor Caa Return Policy

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Item#: 9SIC9ERM7N2699