PTM7950 thermal pad is a highthermalconductivity PhaseChange Material (PCM). It offers longer service life and better performance compared with traditional thermal pads
2 Pack, 30×30×0.25mm. Phasechange temperature: 45°C. Thermal conductivity: 8.5W/m·K. Melting under hightemperature conditions is normal; it will resolidify on cooling. It delivers excellent heatdissipation performance via repeated melting and solidification cycles. Comes with easypeel stickers as accessories, which also assist with protective film removal. Note: Proper technical knowhow and handling skills are required. Professional guidance is recommended for installation. For easier film peeling, you may chill the thermal pad in a refrigerator beforehand
PTM7950 is a proprietary material that delivers longterm reliability while maintaining low thermal impedance (<0.04°C·cm²/W @ no shim). This makes the PTM7950 series ideal for highperformance integratedcircuit devices
The PTM7950 Thermal Pad is engineered to minimize interfacial thermal resistance, sustain outstanding performance, and enable scalable deployment at competitive cost
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PTM7950, a high thermal conductive Phase Change Material (PCM) in pad format, was designed to minimize thermal resistance at interfaces and has the great excellent long term reliability.
Based on a novel polymer PCM system, this material exhibits excellent wetting at interfaces during typical operating temperature range, resulting in very low surface contact resistance.
A proprietary filler material provides high thermal conductivity 8.5W/m ·K and a low thermal impedance (<0.04°C cm²/W), suitable for high performance IC devices.
PTM7950, a high thermal conductive Phase Change Material (PCM) in pad format, was designed to minimize thermal resistance at interfaces and has the great excellent long term reliability.
Based on a novel polymer PCM system, this material exhibits excellent wetting at interfaces during typical operating temperature range, resulting in very low surface contact resistance.
A proprietary filler material provides high thermal conductivity 8.5W/m ·K and a low thermal impedance (<0.04°C cm²/W), suitable for high performance IC devices.
