

Thermal Pad 14.8 W/mK, Non-Conductive Heat Resistance & High-Temperature Resistance
Key Features:
- High performance cooling solution: high thermal conductivity (14.8 W/mK) to ensure fast and efficient heat dissipation
- Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces
- Safe application: non-volatile, flame retardant, metal-free, non-conductive, eliminating the risk of short circuits and discharges
- Easy to install: easily cut with different sizes to align with practical real cooling scenario.

Wide Compatibility:
- Computer hosts ,CPU, GPU, SSD, VRAM, USICS, RDRAMTM, CD-ROM, IGPT module, hard disk drive, notebook computer
- Electronic products, motherboard,Gaming equipment,motor,graphics cards, external pad and foot pad
- Electrical appliances, high-power LED lighting, automotive machinery,communication equipment
- Power equipment, automotive electronic modules (engine scrubber) power modules, high-power power supplies
- Any other electronic equipment that needs to be filled with heat dissipation
![]() Thermal Pad 85×45 | ![]() Thermal Pad 120x120 | ![]() M.2 SSD heatsink | ![]() M.2 SSD heatsink | |
|---|---|---|---|---|
| Customer Reviews | — | — | — | — |
| Price | — | — | — no data | — no data |
| Thermal conductivity (W/mk) | 14.8 W/mK | 14.8 W/mK | Cooling effect of 10 ?-20 ? | Cooling effect of 10 ?-20 ? |
| Non-conductive | ? | ? | ? | ? |



Thermal Pad 14.8 W/mK, Non-Conductive Heat Resistance & High-Temperature Resistance
Key Features:
- High performance cooling solution: high thermal conductivity (14.8 W/mK) to ensure fast and efficient heat dissipation
- Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces
- Safe application: non-volatile, flame retardant, metal-free, non-conductive, eliminating the risk of short circuits and discharges
- Easy to install: easily cut with different sizes to align with practical real cooling scenario.

Wide Compatibility:
- Computer hosts ,CPU, GPU, SSD, VRAM, USICS, RDRAMTM, CD-ROM, IGPT module, hard disk drive, notebook computer
- Electronic products, motherboard,Gaming equipment,motor,graphics cards, external pad and foot pad
- Electrical appliances, high-power LED lighting, automotive machinery,communication equipment
- Power equipment, automotive electronic modules (engine scrubber) power modules, high-power power supplies
- Any other electronic equipment that needs to be filled with heat dissipation
![]() Thermal Pad 85×45 | ![]() Thermal Pad 120x120 | ![]() M.2 SSD heatsink | ![]() M.2 SSD heatsink | |
|---|---|---|---|---|
| Customer Reviews | — | — | — | — |
| Price | — | — | — no data | — no data |
| Thermal conductivity (W/mk) | 14.8 W/mK | 14.8 W/mK | Cooling effect of 10 ?-20 ? | Cooling effect of 10 ?-20 ? |
| Non-conductive | ? | ? | ? | ? |


























