LGA1851 and
LGA1700 CONTACT FRAME: Limited compatibility with a few motherboards: Oversized coolers on the M. 2_1 slot can lead to compatibility problems. An overview and solution is available on the manufacturer's website and in the manual.
LGA1851 and LGA1700 CONTACT FRAME: Improved contact pressure distribution through Inte l mounting frame for efficient heat transfer, thanks to even CPU contact surface
NATIVE AM D OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors - 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard