Graphene Thermal Pad (75x72x0.2mm) - Conductive CPU/GPU Cooling Sheet

UNMATCHED 100
W/mK THERMAL CONDUCTIVITY: Shatter the limits of traditional cooling. While standard graphene pads hover around 15 W/mK, our advanced material delivers a staggering 100 W/mK. This industrial-grade thermal interface material (TIM) ensures maximum heat flux transfer, making it the ultimate choice for high-TDP server CPUs (like AMD EPYC) and extreme overclocking setups where every degree counts.
^^ CRITICAL WARNING: ELECTRICALLY
CONDUCTIVE: Like raw graphene and liquid metal, this high-performance pad is electrically conductive. Exercise extreme caution during installation. Ensure the pad is cut precisely to the size of the CPU/GPU die and does not overflow onto surrounding capacitors, solder points, or PCB traces, as this will cause a short circuit. Recommended for users with technical experience. ^^ DESIGNED FOR AMD EPYC & HIGH-PERFORMANCE COMPUTING: With a massive 75x72mm surface area and an ultra-thin 0.2 mm profile, this pad is engineered to cover large Integrated Heat Spreaders (IHS) completely. It eliminates the "pump-out effect" common in thermal pastes, providing a stable, solid-state thermal bridge that maintains peak efficiency under continuous heavy loads.
^^ NEXT-GEN GRAPHENE TECHNOLOGY: Unlike the brittle carbon sheets found in older products, our pad utilizes a reinforced vertical graphene structure. It offers superior conformability to microscopic surface imperfections while maintaining structural integrity. It is reusable and leaves no messy residue, offering a clean, maintenance-free solution for your cooling infrastructure. ^^
SUPERIOR TO LIQUID METAL SAFETY: While offering thermal performance that rivals liquid metal, this solid pad eliminates the risk of spillage and corrosion. It is the perfect middle ground for enthusiasts who demand the highest thermal transfer rates without the permanent mounting risks of liquid metal. Ideal for direct-die cooling and used high-end electronics.