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TOUSEN TSAD-100 Ultra-Conductive Thermal Paste High-Density Heat Sink Compound for Extreme-Performance CPUs & Power Modules
- Ultra-Low Thermal Resistance (0.028cm²/W) Industry-leading heat dissipation for high-performance CPUs, GPUs, and power modules, ideal for extreme workloads and overclocked systems.
- High Density & Viscosity (2.8g/cm³, 140Pa·s) Dense silicone matrix ensures minimal slump and maximum thermal transfer, even in vertical or complex PCB assemblies.
- Screen-Printable & Thixotropic Effortless application for automated production or DIY projects, achieving ultra-thin bond lines (BLT) for precision cooling.
- Extreme Temperature Range (-50°C to 220°C) Reliable performance in harsh environments, from sub-zero industrial settings to high-power server racks.
- Non-Conductive & Solvent-Free 1.7x10¹² volume resistivity and stable siloxane matrix protect electronics from short circuits and material degradation.
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Redefine Thermal Efficiency with TOUSEN TSAD-100 Thermal Paste Engineered for the most demanding applications, the TOUSEN TSAD-100 Thermal Paste delivers unparalleled thermal management with an ultra-low 0.028 cm²/W thermal resistance and a high-density 2.8 g/cm³ silicone matrix. Designed for high-performance computing, industrial power modules, and automotive electronics, this compound bridges microscopic gaps between components and heatsinks, ensuring rapid heat dissipation even under extreme temperatures (-50°C to 220°C). Precision Engineering for Cutting-Edge Systems The TSAD-100s thixotropic, screen-printable formula offers seamless integration into automated manufacturing or manual applications. Its 140Pa·s viscosity prevents slumping, making it ideal for vertical installations in servers, compact PCB assemblies, or overclocked gaming rigs.
The solvent-free, non-curing design guarantees long-term stability, resisting bleed-out and maintaining consistent thermal conductivity through rigorous use. Built for Industrial Durability & Safety With 1.7 x10¹² volume resistivity, this thermal paste ensures electrical insulation for sensitive components in data centers, renewable energy systems, and automotive power modules. The ultra-thin bond line thickness (BLT) maximizes heat sink contact while minimizing material waste, enhancing device efficiency and lifespan.
Key Applications: *Cooling high-end CPUs, GPUs, and server MPUs in data centers *Thermal management for electric vehicle power modules and industrial machinery *Heat dissipation in high-density PCB assemblies and LED cooling systems *Overclocked PCs, gaming consoles, and renewable energy inverters
The solvent-free, non-curing design guarantees long-term stability, resisting bleed-out and maintaining consistent thermal conductivity through rigorous use. Built for Industrial Durability & Safety With 1.7 x10¹² volume resistivity, this thermal paste ensures electrical insulation for sensitive components in data centers, renewable energy systems, and automotive power modules. The ultra-thin bond line thickness (BLT) maximizes heat sink contact while minimizing material waste, enhancing device efficiency and lifespan.
Key Applications: *Cooling high-end CPUs, GPUs, and server MPUs in data centers *Thermal management for electric vehicle power modules and industrial machinery *Heat dissipation in high-density PCB assemblies and LED cooling systems *Overclocked PCs, gaming consoles, and renewable energy inverters
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by StarDragon Return Policy
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