Your Browsing History
- Free 30-day Returns
$376.99
Meet Your Seller
Copper GPU Water Cooling Block GPU Waterblock for XFX AMD Mercury Radeon RX 9070 XT OC 16GB GDDR6, for XFX RX9070 XT OC Magnetic Air Graphics Cards
- (1).0.33mm jet micro water channel increases the heat absorption area, with up to 44 water channels. The copper plate length is extended to 158.451mm, increasing the water flow coverage area and providing powerful heat dissipation performance.
- (2).Matte finish texture craftsmanship, using high-quality materials, with upper and lower sandwich installation, providing all-round protection.
- (3).Reduce the weight of GPU BLOCK, protect PCB from deformation, and use chemical nickel plating surface treatment process to effectively prevent corrosion and erosion.
- (4).6MM design, sufficient materials, using single-layer sealing ring design, effectively reducing the risk of liquid leakage.
- (5).While ensuring the ability to withstand installation pressure, a copper base thickness of 0.35mm is used to effectively reduce the thermal resistance of the copper plate and improve thermal conductivity efficiency.
+
+
Overview
Specs
Reviews
Any questions? Our AI beta will help you find out quickly.
Try me now
(1). 0.33 mm jet micro water channel increases the heat absorption area, with up to 44 water channels. The copper plate length is extended to 158.451 mm, increasing the water flow coverage area and providing powerful heat dissipation performance. ^^ (2). Matte finish texture craftsmanship, using high-quality materials, with upper and lower sandwich installation, providing all-round protection. ^^ (3). Reduce the weight of GPU BLOCK, protect PCB from deformation, and use chemical nickel plating surface treatment process to effectively prevent corrosion and erosion. ^^ (4).
6MM design, sufficient materials, using single-layer sealing ring design, effectively reducing the risk of liquid leakage. ^^ (5). While ensuring the ability to withstand installation pressure, a copper base thickness of 0.35 mm is used to effectively reduce the thermal resistance of the copper plate and improve thermal conductivity efficiency.
6MM design, sufficient materials, using single-layer sealing ring design, effectively reducing the risk of liquid leakage. ^^ (5). While ensuring the ability to withstand installation pressure, a copper base thickness of 0.35 mm is used to effectively reduce the thermal resistance of the copper plate and improve thermal conductivity efficiency.
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
- CONTACT
Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Detail Driven Return Policy
Manufacturer Contact Info
- For a directory of all our manufacturers, please click below.
- Manufacturers Directory
LOADING...











