FEHONDA 16W/mK Thermal Putty for GPU VRAM, 100g, Non-Conductive Gap Filler

16W/mK
THERMAL CONDUCTIVITY: FEHONDA Thermal Putty GPU formulated with high-content premium high thermal conductivity fillers, helps solve CPU thermal throttling and maintain the PC's full-load stability. Suitable for replacing traditional thermal pads in GPU modifications. It can be applied at a thickness as thin as 0.2 - 0.3 mm, effectively fills uneven micro-gaps between processors and heatsinks to ensure optimal heat dissipation ^^
EASY APPLICATION: It is easy to apply with a spatula or a finger sleeve. Its viscosity ensures it spreads smoothly and evenly for a consistent layer across the surface. Recommend using latex gloves to shape the paste into balls or discs and then apply them where needed ^^
STABLE HEAT DISSIPATION: The Thermal Putty Laptop's low-volatility silicone oil formulation resists oil-powder separation and evaporation, as demonstrated by a 1000+ hour thermal shock test with no drying, no cracking, and no sagging. Ensuring long-term, stable heat dissipation performance, has a long operational life time ^^
NON-CONDUCTIVE FORMULA: The thermal putty features non-conductive properties, providing safe application on sensitive electronic components without risk of electrical shorts, making it suitable for direct contact with circuit boards and processors ^^
WIDE COMPATIBILITY: The wide working temperature range (-40-180) of the 100g Thermal Putty & its Insulation properties make it suitable for all electronic components in need of heat dissipation, such as CPUs, GPUs, Xbox, processors, SSDs, PCBs, RAM, VRAM, graphics card and for PS4/PS5 consoles.