FEHONDA 16W/mK Thermal Putty for GPU VRAM, 50g, Non-Conductive Gap Filler

16W/mK
THERMAL CONDUCTIVITY: FEHONDA Thermal Putty GPU formulated with high-content premium high thermal conductivity fillers, helps solve CPU thermal throttling and maintain the PC's full-load stability. Suitable for replacing traditional thermal pads in GPU modifications. It can be applied at a thickness as thin as 0.2 - 0.3 mm, effectively fills uneven micro-gaps between processors and heatsinks to ensure optimal heat dissipation ^^
EASY APPLICATION: It is easy to apply with a spatula or a finger sleeve. Its viscosity ensures it spreads smoothly and evenly for a consistent layer across the surface. Recommend using latex gloves to shape the paste into balls or discs and then apply them where needed ^^
STABLE HEAT DISSIPATION: The Thermal Putty Laptop's low-volatility silicone oil formulation resists oil-powder separation and evaporation, as demonstrated by a 1000+ hour thermal shock test with no drying, no cracking, and no sagging. Ensuring long-term, stable heat dissipation performance, has a long operational life time ^^
NON-CONDUCTIVE FORMULA: The thermal putty features non-conductive properties that provide safe application on sensitive electronic components without risk of electrical short circuits, making it reliable for use on processors, graphics cards, and circuit boards ^^
WIDE COMPATIBILITY: The wide working temperature range (-40C-180C) of the 50g Thermal Putty and its Insulation properties make it suitable for all electronic components in need of heat dissipation, such as for CPUs, GPUs, Xbox, processors, SSDs, PCBs, RAM, VRAM, graphics card and for PS4/PS5 consoles