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The GIGABYTE Ultra Durable 3 design features twice the copper for both the power and ground layers of the PCB, dramatically lowering system temperature by efficiently spreading heat from critical areas of the motherboard (such as the CPU power zone) throughout the entire PCB. GIGABYTE's Ultra Durable 3 also lowers the PCB impedance by 50%, which helps to reduce electrical waste and further lowers component temperatures. A 2x Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking.