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Built for overclocking, the Xtreem TXD316G2133HC11DC01 Memory Kit comes with 16GB super-sized capacity The original chips were carefully selected using the exclusive granule screening technology and all have gone through meticulous tests and verifications for high performance and reliability. Complete with a dual-channel configuration and DDR3 2133 MHz speeds (17.0GBps), demanding gamers or 3D graphic workers now can enjoy agile and stable running. The advanced heatsink design speeds up heat dissipation, ensuring great stability and reliability.
DDR3 2133Rated at 2133 MHz at 11-11-11-28, the memory kit delivers up to 17.0 GBps per channel to meet the evolving needs of current operating systems and applications.
Dual Channel KitThe Xtreem TXD316G2133HC11DC01 comes with a dual-channel configuration, providing double bandwidth on a compatible platform as well as optimized compatibility and reliability.
Efficient coolingThe memory module carries the unique X-shape heat radiation chipset. The high-coefficient conductive gel grabs the granules tightly to maximize the overall heat radiation efficiency and brings the Xtreem series the unique cool touch under extreme speed.
XMP V1.3 readyWhether you are a overclocking beginner or veteran, XMP (Intel Extreme Memory Profile) technology provides a robust and profile-based overclocking solution. Select the predefined profile in the BIOS, or manually adjust the timing or frequency to obtain the maximum performance.