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Cooler Master IceFusion - 200 g High Performance Thermal Compound

  • System builder value size contains enough compound for 500 applications
  • Resealable package
  • High thermal conductivity.
Please note that this product is non-returnable and non-refundable.
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With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.

High thermal conductivity. Low thermal resistance. Non-corrosive. Best thermal stability in high temperature. Excellent adhesion. Preserve in room temperature for longer lifespan.

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