Thermal Compound / Grease

UPSIREN U6 PRO 10g applicator tube Precision thermal putty for thin heat sinks;12.8 W/m·K*.Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky;

UPSIREN U6 PRO 10g applicator tube Precision thermal putty for thin heat sinks;12.8 W/m·K*.Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky;

$16^.99

$20.00

$8.00 Shipping

UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and gaming consoles.

UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and gaming consoles.

$49^.99

$59.90

UPSIREN U6 PRO 10g jar Thermal putty for thin heat sinks in gaming laptops and slim consoles. Soft, lightly tacky thermal putty that levels mixed heights and stays in place.

UPSIREN U6 PRO 10g jar Thermal putty for thin heat sinks in gaming laptops and slim consoles. Soft, lightly tacky thermal putty that levels mixed heights and stays in place.

$14^.99

$8.00 Shipping

UPSIREN U6 PRO 50g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky compound for tight layouts; ideal layer thickness ~12 mm; targets GDDR6 VRAMs

UPSIREN U6 PRO 50g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky compound for tight layouts; ideal layer thickness ~12 mm; targets GDDR6 VRAMs

$51^.00

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