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UPSIREN U6 PRO 10g provides the same high-performance thermal putty in an applicator tube format that simplifies precision work on crowded boards. Designed for thin formfactor heat sinks, it creates a cohesive, conformable bridge that helps compact cooling solutions keep temperatures in check where soft pads fall short.
Packaging advantage 10 g applicator tube: narrow outlet enables one-handed, drop-by-drop dosing under magnification, tracing tidy lines along VRAM rows, standoffs, and frame edges with minimal cleanupideal for travel kits and multipurpose benches.
The material is soft and just sticky enough to stay put while you seat the heat sink, yet it spreads smoothly to even out minor height differences. Beginners can achieve neat, repeatable interfaces by applying a thin film and building to ~12 mm total thickness before reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.
Packet includes:
1 × 10 g applicator tube of UPSIREN U6 PRO thermal putty
1 × plastic spatula
2 × protective finger sleeves
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).