Features: Axiom's DDR4 Modules use the latest evolutionary DRAM design, provides improved speed, power management and reliability. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.
High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.
DDR4 Features:
100% Increase in speed - Faster Data Rate equates to more responsive application loads on data-intensive programs.
300% increase in component densities - Equals larger modules for next-generation performance demands.
20% decrease in power consumption - Less power consumed means less wasted resources to cool systems ...
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Serial ATA (SATA): 4 x SATA3 6.0Gb/s Connectors, support RAID, NCQ, AHCI and Hot Plug*
* M2_2 and SATA3_3_4 share lanes. If either one of them is in use, the other one will be disabled.