Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 1.5mm
Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.