Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 0.3mm
Features: 10 pcs of 8.8x8.8x5mm aluminum heat sinks with 3M 8810 Heat transfer Peel and Stick Tape
Widely use for 3D Printer A4988 chipset,computer PC chipset, power IC, power electric device, LED light devices,Raspberry Pi,Banan Pi, Orange Pi,etc.
Come with 3M 8810, is a tacky pressure sensitive adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface.
The specialized chemistry of 3M 8810 renders the tape modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface
Excellent adhesive performance with good wetting and flow onto many substrate surfaces....