PTM7950 by CSGR® 40×40×0.25 mm phasechange thermal pad for CPUs/GPUs; 8.5 W/m·K*. High performance phasechange pad (melts near 45°C) that wets surfaces, fills microgaps, and resolidifies.

PTM7950 by CSGR® is a premium phase change thermal interface designed for flat interfaces such as CPUs, GPUs, and heat spreaders. At operating temperature, it softens, flows to wet both surfaces, and fills microscopic voids; on cooldown, it resolidifies to maintain a thin, uniform bond line for consistent heat transfer. The material delivers 8.5 W/m·K* conductivity while remaining electrically nonconductive and safe near dense SMD layouts. It withstands up to 150 °C and extensive thermal cycling, making it suitable for long, demanding service in desktops, laptops, and consoles. PTM7950 by CSGR® is a registered trademark of Computer Systems. Store sealed in a cool, dry place to maintain long term stability.

Why 40×40×0.25 mm is the sweet spot: The 40 mm square spans the active contact zone of most CPU/GPU heat spreaders while remaining easy to trim for smaller dies, so coverage is complete without overhang. The 0.25 mm thickness keeps the bondline thinlowering thermal resistance (Rth t / kA)yet provides enough compliance to absorb typical flatness and height variations. Under clamp load PTM7950® by CSGR softens near its phase-change temperature and flows to wet the microscopic asperities of both surfaces, expelling trapped air; on cooldown, it resolidifies to lock in uniform pressure. Full performance is typically reached after a few thermal cyclesnormal heatup under load and cooldown to ambientover the first couple of days, as repeated cycles continue to collapse microvoids and settle the material to a stable, high-contact bond line.

Packet includes:

1 × PTM7950 by CSGR® sheet, 40×40×0.25 mm (protective films on both sides)

1 × resealable storage envelope

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).