Liquid Metal by CSGR 1g & K5 PRO® 20g set 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty. High-performance cooling bundle that pairs liquid metal for direct die CPU/GPU use with K5 PRO®.

This bundle combines two complementary materials for demanding cooling upgrades. Use Liquid Metal by CSGR on flat CPU/GPU contact zones where ultrahigh heat flux demands a metal interface. Surround the target area with K5 PRO® nonconductive thermal putty to form a neat barrier that helps prevent liquid metal migration and to bridge surrounding VRAM/VRM gaps (up to about 3 mm), restoring even clamp pressure and reliable heat transfer. The set is designed for enthusiasts and service benches that want both maximum performance and controlled application in one purchase.

Packet includes:

1 × 1 g applicator tube of Liquid Metal by CSGR

1 × 1.6 mm plastic applicator tip

1 × fine needle tip for precision dosing

1 × 20 g jar of K5 PRO® thermal putty

1 × wooden applicator

1 × instruction leaflet

Liquid Metal by CSGR is a premium thermal interface for users who want the highest possible heat transfer in compact modern systems. With thermal conductivity of 79 W/m·K*, it is engineered for direct die CPU and GPU applications, high-density VRM hotspots, and other areas where conventional pastes cannot remove heat fast enough. The formulation wets copper and nickel-plated cold plates efficiently to minimize thermal resistance, helping unlock headroom for quiet profiles or extreme performance.

Because it is electrically conductive, careful application is essential. Frame the component with K5 PRO® nonconductive thermal putty to create a neat perimeter, limiting any chance of liquid metal creeping to neighboring SMDs while also filling peripheral gaps. Avoid aluminum surfaces and always use small, metered amounts on clean, polished contact zones.

Packet includes:

1 × 1 g applicator tube of Liquid Metal by CSGR

1 × 1.6 mm plastic applicator tip

1 × fine needle tip for precision dosing

K5 PRO 20g is a viscous, nonconductive thermal putty created to make pad replacement straightforward for everyonefrom first time DIY users to seasoned technicians. Trusted since 2013 and adopted widely across repair communities, it has earned a reputation as one of the most widely used thermal putties worldwide for several years thanks to its forgiving workability and consistent results.

The 20 g jar is the all-around choice for repeat repairs or multiple devices. It provides generous coverage for full laptop or console refreshes and small GPU projects, while staying easy to store, dispense, and handle for careful, incremental application.

As a daily solution, K5 PRO covers the vast majority of pad replacement scenarios on laptops, desktops, and consoles. It spreads smoothly, holds its shape, and maintains cohesive contact between components and heat sinkseven across uneven surfaces and around height variationsso you can restore reliable heat transfer without hunting for exact pad thicknesses.

Beyond standard repairs, K5 PRO also solves thermal transfer challenges in custom or compact builds. Use it to create a controllable heat bridge from hot components to metal housings or frames in devices such as home routers, access points, LED light bars/panels, DVRs/NVRs, and single-board computer enclosures. Users around the world have reported lower memory temperatures, quieter fans, and improved stability after replacing aged or poorly sized pads, with consistent gains when dealing with mixed gap heights and irregular interfaces. Store sealed, away from frost and dust; keep in a cool, dry place to maintain long-term stability.

Packet includes:

1 × 20 g jar of K5 PRO thermal putty

1 × wooden applicator

1 × instruction leaflet

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).