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UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and gaming consoles.
- Water cooling ready: fills tolerances beneath cold plates where ordinary paste cannot hold a thermal path, delivering loop performance directly to GDDR6/GDDR6X modules, VRM stages and controllers across wide, uneven footprints.
- High viscosity, hand moldable body shapes to the exact zone you need, then stays put under pressure; resists pumpout and creep during extended high temperature operation in gaming, mining and AI systems.
- Ideal for large gaps: creates a stable 24 mm interface around standoffs, frame edges and mixed height component clusters, eliminating guesswork with stacked pads and improving contact uniformity.
- Maximum possible thermal conductivity for a non-electrically conductive putty (16.8 W/m·K*), enabling efficient heat transfer while remaining electrically safe around dense SMD layouts.
- 20 g capacity matched to one GPU or one console service; decant working amounts for microscope jobs while keeping the remainder sealed to preserve texture, cleanliness and repeatability.
- UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIA GeForce RTX 3080/3090/4080/4090 graphics boards, and AMD Radeon RX 6800/6900/7900 series cards, and other systems that use thermal pads or thermal putties.
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UPSIREN UX PRO Ultra 20g is a performance focused thermal putty for large tolerance cooling assembliescustom water cooling blocks, desktop video boards and high power consoles. It builds a robust thermal path across wide, uneven interfaces around GDDR6/GDDR6X VRAM, VRM power stages and controller chips. With 16.8 W/m·K* conductivity while remaining electrically nonconductive, it supports sustained loads in systems that run hot for hours.
This 20 g jar is sized for a typical single service on one desktop GPU or one game console, including full VRAM/VRM coverage at the recommended thickness. Its easy to decant small portions for precise placement, then reseal to keep the remaining compound clean for touch ups.
Where water cooling excels in capacity, it often struggles with contact: cold plates and component clusters rarely meet perfectly, and standard thermal paste cannot bridge millimeter-scale gaps. UX PRO Ultra solves this by holding a uniform 24 mm layer under clamp force, maintaining contact that paste alone cant achieve so the loops cooling potential reaches the parts that need it.
The compound is intentionally more viscous and only lightly tacky so you can shape it exactly where its needed. Use the provided sleeves to knead a ribbon or pad between your fingers, place it on the components, and press for a clean, even footprint. Once seated, it resists pumpout and creep through long gaming, mining or AI workloads. Produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research cofunded by Greece and the European Union.
Packet includes:
1 × 20 g jar of UPSIREN UX PRO Ultra thermal putty
1 × plastic spatula
2 × protective finger sleeves
*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).
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- Return for refund within: 30 days
- Return for replacement within: 45 days
- This item is covered by CS LABS Return Policy
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