Features: K2 PRO SPECIFICATIONS:
Printing Technology: Fused Deposition Modeling
Build Volume: 300 x 300 x 300 mm
Printing Speed: Max 600 mm/s
Acceleration: Max 20000 mm/s2
Printing Accuracy: 100±0.1 mm
Layer Height: 0.05-0.3 mm
Extruder: Dual-gear direct drive extruder
Filament Diameter: 1.75 mm
Nozzle Diameter: 0.4 mm
Nozzle Temperature: Max 300 °C
Heatbed Temperature: Max 110 °C
Chamber Temperature: Max 60°C
Build Plate: Flexible PEI build plate
Leveling Mode: Full-auto leveling
XYE Motor: Step-servo motors for XY axis and extruder
File Transfer: USB Drive/Ethernet/WiFi
File Storage: 32GB EMMC
RFID Sensor Printer: Included
Rated Voltage: 100-240V ~ AC 50/60 Hz
Display Screen: 4" color touch screen
Rated Power: 1300W
Supported Filaments: PLA...
Protocols: LLDP-MED for VLAN discovery; IPv4; TCP (RFC 793) in SSL/TLS; Domain Name System (DNS): A records (RFC 1706), SRV records (RFC 2782), RTP (RFC 1889, 1890), RFC 5966
Security: HTTPS secure provisioning; Local Access Interface: IVR password
Security: NETWORK AND SECURITY
Built-in dual-band Wi-Fi:
- Network standard: 2.4G&5G IEEE802.11a/b/g/n/ac/ax
- Frequency range: 2.4 GHz/ 5.0 GHz
- Roaming: IEEE802.11 k/r/v
Built-in Bluetooth 5.0:
- Connecting to Bluetooth Headset
IPv4/IPv6
SIP v1 (RFC2543), v2 (RFC3261)
Call server redundancy supported
NAT traversal: STUN mode
SIP link mode: Proxy mode and peer-to-peer
IP Assignment: static/DHCP
HTTP/HTTPS web server
Time and date synchronization using SNTP
SRTP for voice
TLS1.3 support
HTTPS certificate manager
AES encryption for configuration file (AES256)
Digest authentication using MD5/MD5-sess
OpenVPN, IEEE802.1X
WPA, WPA2, WPA3
Secure boot
GARP (Generic Attribute Registration Protocol)