Features: K2 PRO SPECIFICATIONS:
Printing Technology: Fused Deposition Modeling
Build Volume: 300 x 300 x 300 mm
Printing Speed: Max 600 mm/s
Acceleration: Max 20000 mm/s2
Printing Accuracy: 100±0.1 mm
Layer Height: 0.05-0.3 mm
Extruder: Dual-gear direct drive extruder
Filament Diameter: 1.75 mm
Nozzle Diameter: 0.4 mm
Nozzle Temperature: Max 300 °C
Heatbed Temperature: Max 110 °C
Chamber Temperature: Max 60°C
Build Plate: Flexible PEI build plate
Leveling Mode: Full-auto leveling
XYE Motor: Step-servo motors for XY axis and extruder
File Transfer: USB Drive/Ethernet/WiFi
File Storage: 32GB EMMC
RFID Sensor Printer: Included
Rated Voltage: 100-240V ~ AC 50/60 Hz
Display Screen: 4" color touch screen
Rated Power: 1300W
Supported Filaments: PLA...
Protocols: DHCP VLAN discovery; LLDP-MED for VLAN discovery; FTP/TFTP/HTTP/HTTPS server-based central provisioning; Hardware diagnostics; Manual or dynamic host configuration protocol (DHCP) network setup; Network address translation support for static configuration and Keep-Alive; QoS Support — IEEE 802.1p/Q tagging (VLAN), Layer 3 TOS, and DHCP; Status and statistics reporting; Syslog Event Logging; Conforms to IEEE802.3-2005 (Clause 40) for physical media attachment; Conforms to IEEE802.3-2002 (Clause 28) for link partner auto negotiation; Time and date synchronization using SNTP; RTCP and RTP support; IPv4; IPv6; Provisioning and call server redundancy support; DNS-SRV; UDP; SIP protocol support; IETF SIP (RFC 3261 and companion RFCs)