Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
Long Term Operating Temperature: -150 °C / +200 °C
Specifications: Even though the amount of metallic elements in Aeronauts formula is lower in comparison to our other products, it still provides reliable and perfomant thermal conductivity.
In our lab tests, Aeronaut showed a high amount of wear resistance under high temperatures, and acts also surface-protecting. The removal of Aeronaut thermal grease causes far less micro scratches on the components surface compared to other products.
Specifications: Renowned premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink; more than 150 awards and recommendations
Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.