Features: K2 PRO SPECIFICATIONS:
Printing Technology: Fused Deposition Modeling
Build Volume: 300 x 300 x 300 mm
Printing Speed: Max 600 mm/s
Acceleration: Max 20000 mm/s2
Printing Accuracy: 100±0.1 mm
Layer Height: 0.05-0.3 mm
Extruder: Dual-gear direct drive extruder
Filament Diameter: 1.75 mm
Nozzle Diameter: 0.4 mm
Nozzle Temperature: Max 300 °C
Heatbed Temperature: Max 110 °C
Chamber Temperature: Max 60°C
Build Plate: Flexible PEI build plate
Leveling Mode: Full-auto leveling
XYE Motor: Step-servo motors for XY axis and extruder
File Transfer: USB Drive/Ethernet/WiFi
File Storage: 32GB EMMC
RFID Sensor Printer: Included
Rated Voltage: 100-240V ~ AC 50/60 Hz
Display Screen: 4" color touch screen
Rated Power: 1300W
Supported Filaments: PLA...
Specifications: Bus Type:PCI Express
Type Standard:Profile (LP bracket incl.)
Chipset:NEC UPD720201
Interface: USB 3.0 Port
Type and Rate :USB 3.0 - 5 Gbit/s
Connector Type(s): 1 - PCI Express x1 Male
External Ports: 2 - USB Type-A (9 pin) USB 3.0 Female
Internal Ports : 2 x US 3.0 Internal Ports (20 pin connector) front panel for floppy bay
Internal Ports : 1 - SATA 15 pin interface
Package Contents: 1 x PCIe USB 3.0 PCI express card
1 x Driver CD