Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
Features: Designed specifically for AMD Socket AM4 CPU's motherboards.
Made of copper and plastic, good heat dissipation, prevents deformation, and a long service life.
Good heat dissipation to ensure the CPU works properly.
There is a small hole corresponding to the motherboard on the pin, which is firm and practical. The installation hole distance is 90x54mm.
Color: Black,White.Package Includes:1PC AM4 Backplane.