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  5. Thermal Hero

  6. Item#: 9SIA2W0KN01661

GIGABYTE X870 AORUS ELITE WIFI7 ICE AM5 LGA 1718, ATX, DDR5, 4x M.2, PCIe 5.0, USB4, Wi-Fi 7, 2.5GbE LAN, EZ-Latch, 5-Year Warranty
GIGABYTE X870 AORUS ELITE WIFI7 ICE AM5 LGA 1718, ATX, DDR5, 4x M.2, PCIe 5.0, USB4, Wi-Fi 7, 2.5GbE LAN, EZ-Latch, 5-Year Warranty
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    GIGABYTE X870E AERO X3D WOOD AMD AM5 LGA 1718 Motherboard, ATX, Supports AMD Ryzen 9000/8000/7000 Series Processors, DDR5, 16+2+2 Total Power Phase, 4x M.2, PCIe 5.0, USB4 Type-C, WIFI7, Dual 5 GbE LA
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    GIGABYTE X870E AERO X3D DARK WOOD AMD AM5 ATX Motherboard, Support Ryzen 9000/8000/7000 Series, DDR5, 16+2+2 Power Phase, 4x M.2, PCIe 5.0, USB4, WIFI7, Dual 5GbE, EZ-Latch, 5-Year Warranty
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    THERMAL HERO ULTRA Series Thermal Paste 2g, Ultra High Thermal Conductive, For PC Cooling, Extreme-Overclocking, Gaming, Xbox, Playstation

    (1) Write a Review
    • PERFORMANCE: ULTRA HIGH Thermal conductivity and low thermal resistance even for exceptional heat dissipation and High Cooling Performance.Longtime & High Stability at highest temperatures.
    • HIGH DURABILITY & SAFE: No corrosion or oxidation. NOT Toxic. NOT Electrically Conductive. ROHS and REACH Compliant. Does not dry out, harden or dissolve into its components. 5 Years Warranty in unopen condition.
    • EASY TO USE: This -customer friendly- paste has high flow properties and low viscosity. It is easy to apply on any surface and by any method.
    • SUITABLE APPLICATIONS: SPECIAL for OVERCLOCKING and GAMING, all types of CPU, GPU, IC, Playstation/XBOX/Gaming Consoles.
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    GIGABYTE B850 AORUS ELITE WIFI7 ICE AMD AM5 LGA 1718 Motherboard, ATX, DDR5, 3x M.2, PCIe 5.0, USB-C, WIFI7, 2.5GbE LAN, EZ-Latch, 5-Year Warranty
    GIGABYTE B850 AORUS ELITE WIFI7 ICE AMD AM5 LGA 1718 Motherboard, ATX, DDR5, 3x M.2, PCIe 5.0, USB-C, WIFI7, 2.5GbE LAN, EZ-Latch, 5-Year Warranty
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    Overview
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    The Thermal Hero ULTRA is a silicone-based thermal paste with ultra-high cooling performance. The ULTRA series is a paste with a very low thermal resistance and high thermal conductivity. This allows the paste to achieve very high cooling performance at sustained high CPU temperatures. The paste was developed for the newer processor generations with higher clock rates, which still have overclocking potential. One of the main features of the paste is that achieve a good cooling performance at high clock rates and clock rate peaks. The paste reacts flexibly to temperature changes and dissipates heat quickly and/or constantly according to the performance requirements.

    Your computing power and processor are well protected by efficient heat dissipation.

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