"metal thermal paste"

Limited time offer, ends 12/02

• Model #: ZZL-RNU-ASD1188706

Limited time offer, ends 12/02

• Model #: BL-TCACMX44GA

Limited time offer, ends 12/02

• Volume / Net Weight: 0.25 lb
• Long Term Operating Temperature: -50 to 130 C
• Model #: AS5-12GX5

• Model #: LSX-SR-0123

• Model #: LSX-SR-0122

• Model #: LSX-SR-0121

• Model #: 680952003542

• Model #: 9359014278723

• Type: Liquid Cooling System
• Block Compatibility: Intel Socket LGA 1700/1200/115X AMD Socket AM5, AM4
• Block Compatibility - AMD: AMD Socket AM5, AM4
• Block Compatibility - Intel: Intel Socket LGA 1700/1200/115X
• Model #: SKADI LCD 360

• Model #: PH-GC-02-I

• Volume / Net Weight: 20g
• Thermal Conductivity: >3.17W/(m-K)
• Long Term Operating Temperature: -22 - 464(F)
• Specifications: Odorless, low oil content, non-volatile, non-corrosive, non-toxic, flame retardant, not electrically conductive
• Model #: PST-D

• Thermal Conductivity: 62,5 W/mk
• Long Term Operating Temperature: -250 °C / +150 °C
• Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive. Carbonaut is available pre-assembled in many standard CPU / GPU sizes. Size - CPU/GPU 32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K 38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X 51 x...
• Model #: TG-CA-31-25-02-R

• Volume / Net Weight: 3.5g
• Long Term Operating Temperature: -30~150
• Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
• Model #: GC-4-3.5g

(18)

• Type: Liquid Cooling System
• Block Compatibility: Intel LGA 2066/2011-3/2011/1851/1700/1200/1156/ 1155/1151/1150 AMD AM5/AM4/AM3+/AM3/AM2+/AM2/FM2/FM1
• Block Material: Copper
• Radiator Size: 396 x 120 x 27 mm
• Model #: CL-W384-PL12SW-A

• Model #: 1-Water-Cooling0580

• Model #: 1-CPUThermal0512

• Model #: 1-CPUThermal0313

• Model #: 1-CPUThermal1113

• Model #: 1-CPUThermal0431

• Model #: 1-CPUThermal1045

• Model #: 1-CPUThermal1147

Limited time offer, ends 12/01

• Volume / Net Weight: 3ml / 7.8g
• Thermal Conductivity: 11.8 W/mk
• Long Term Operating Temperature: -200 °C / +350 °C
• Specifications: The Hydronaut thermal grease delivers optimal heat transfer capabilities for larger-scale cooling solutions like water cooling systems. Hydronaut thermal grease consists of a silicon-free structure. The makes it very light and highly flexible and easy to apply. Hydronaut achieves best results if used on medium- to large-scale cooling solutions. This product is ROHS-compliant for demanding users.
• Model #: TG-H-030-R

• Model #: gelid-3.5g

• Parts: NA
• Labor: NA
• Model #: CR-CP5

• Model #: a21032600ux0337

• Model #: a21032600ux0283

• Model #: TG-A-030-R-7.8g.

• Volume / Net Weight: 3.0g
• Thermal Conductivity: 16 w/mk
• Long Term Operating Temperature: -45 to 200 C
• Specifications: Thermal compound
• Model #: JP-DX1

• Compatibility: CPU
• Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating. With this copper pad to greatly lower gpu temperatures, can be used for graphics, northbridge, CPU chips. It can be used as heatsink solution for Xbox ,PS4 and all laptop and computer such as HP,Dell,Acer,Thinkpad etc. Package included: 10 pcs Thermal Conductive Copper Shims 20mm x 20mm x 0.5mm
• Dimensions: 20mm x 20mm x 0.5mm
• Model #: 11-001-270

• Compatibility: CPU
• Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating. With this copper pad to greatly lower gpu temperatures, can be used for graphics, northbridge, CPU chips. It can be used as heatsink solution for Xbox ,PS4 and all laptop and computer such as HP,Dell,Acer,Thinkpad etc. Package included: 10 pcs Thermal Conductive Copper Shims 20mm x 20mm x 0.8mm
• Dimensions: 20mm x 20mm x 0.8mm
• Model #: 11-001-271

• Specifications: Thermal Conductivity: 3.3 W/m-k Dimension: 120.5 x 71 x 16.3 mm Color: Gray Weight: 1.5g Shelf-Life: 24 months from DOM
• Model #: CL-O001-GROSGM-A

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G

• Specifications: Material Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~12(wt%) Antioxidant 0.5~2(wt%) Adhesiveness: 330000Cps Thermal Conductivity: 11.2 W/m - Degree C Thermal Impedance (Resistance): 0.013 Degree C-in2/W Included: One syringe of thermal compound and one easy-to-spread spoon Specific Gravity: 2.7g/cm3
• Model #: PRO-PK3-30G

• Type: CPU Block
• Model #: PC-ICE2-BR