"thermal compound"

• Specifications: Material Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~12(wt%) Antioxidant 0.5~2(wt%) Adhesiveness: 330000Cps Thermal Conductivity: 11.2 W/m - Degree C Thermal Impedance (Resistance): 0.013 Degree C-in2/W Included: One syringe of thermal compound and one easy-to-spread spoon Specific Gravity: 2.7g/cm3
• Model #: PRO-PK3-30G

• Specifications: Material Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~12(wt%) Antioxidant 0.5~2(wt%) Adhesiveness: 330000Cps Thermal Conductivity: 11.2 W/m - Degree C Thermal Impedance (Resistance): 0.013 Degree C-in2/W Included: One syringe of thermal compound and one easy-to-spread card. Specific Gravity: 2.7g/cm3
• Model #: PRO-PK3-1.5G

• Specifications: Material Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~12(wt%) Antioxidant 0.5~2(wt%) Adhesiveness: 330000Cps Thermal Conductivity: 11.2 W/m - Degree C Thermal Impedance (Resistance): 0.013 Degree C-in2/W Included: One syringe of thermal compound and one easy-to-spread spoon Specific Gravity: 2.7g/cm3
• Model #: PRO-PK3-5G

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G

Limited time offer, ends 01/15

• Model #: Thermalright Thermal Pad-0.5mm

• Model #: TG-3XKE002

• Model #: C-005 combo

Limited time offer, ends 01/19

• Volume / Net Weight: 50g
• Thermal Conductivity: 10.5W/mK
• Long Term Operating Temperature: -50 to 250 C
• Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
• Model #: Newegg005

• Model #: CE-001 Combo

Limited time offer, ends 01/15

• Volume / Net Weight: 15g
• Thermal Conductivity: 12.8 W/mK,
• Long Term Operating Temperature: -40 C to +400C
• Specifications: Thermal Conductivity:12.8W/M-K Density:3.3±0.1 Hardness:40-80(Sc) Breakdown Voltage:>6KV/Mm Temperature Range:-40°C~200°C
• Model #: Thermalright Thermal Pad-2mm

Limited time offer, ends 01/15

• Model #: Thermalright Thermal Pad-1mm

Limited time offer, ends 01/15

• Model #: Thermalright Thermal Pad-1.5mm

Limited time offer, ends 01/15

• Model #: AACTCP00059A

• Model #: B0795DP124

Limited time offer, ends 01/15

• Model #: 4f3-582122000380443

• Model #: tg-c-005

Limited time offer, ends 01/19

• Part Number: 9EL
• Volume / Net Weight: 2.0g
• Thermal Conductivity: 13.5 W/mK
• Long Term Operating Temperature: -50 to 250 C
• Model #: Newegg055

• Model #: TG-P-P-100-R

• Model #: TG-CE-005-R

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity. Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
• Model #: TG-MP8-120-20-05 2R

• Model #: TG-MP-P-120-20-20-2

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Model #: TG-MP8-100-100-15 1R

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Model #: TG-MP8-30-30-05 1R

• Model #: TG-MP-P-120-20-30-2

• Model #: TG-MP-P-120-20-15-2

• Model #: TG-MP-B-100-100-20-2

• Model #: TG-MP-A-100-100-20-2

• Model #: TG-MP-B-100-100-10-2

• Thermal Conductivity: 8.5 W/mK
• Model #: XBP-40402-2PACK

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• Model #: MGY-ADSK-N03G-R1

• Model #:

• Model #: PH-GC-02-I

• Model #: TP-VP05-B

• Thermal Conductivity: 62,5 W/mk
• Long Term Operating Temperature: -250 °C / +150 °C
• Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive. Carbonaut is available pre-assembled in many standard CPU / GPU sizes. Size - CPU/GPU 32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K 38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X 51 x...
• Model #: TG-CA-31-25-02-R

• Model #: TG-KS-24-12

• Model #: 90x50x0.5mm-2pcs