Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
Volume / Net Weight: 1.5 ml in Syringe (Grease Cleaner is / are NOT Included)
Thermal Conductivity: 9.0 W/mK
Specifications: Specific Gravity: 2.6 (g/cm3) (25°C)
Color: Gray
Improves heat transfer from chipset to cooler base or heatpipes
Precise and Even
Easy to spread and remove without surface damage
Specifications: Dimensions
50x50 mm or 145x145 mm(based on model)
Thickness
0.5 mm or 1.0 mm or 1.5 mm (based on model)
Thermal Conductivity
6.0 W/mK
Hardness
25 Shore 00
Specific Gravity
3.2 g/cm3
Colour
Blue
Continuous Use Temperature
-40~200 C
Volume resistance
1 X 1012 O-cm
Breakdown Voltage
12 KV/mm
Tensile strength
2.5 Kgf/cm²
Elongation
45 %