Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 1.5mm
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 0.6mm
Features: Axiom's DDR4 Modules use the latest evolutionary DRAM design, provides improved speed, power management and reliability. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.
High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.
DDR4 Features:
100% Increase in speed - Faster Data Rate equates to more responsive application loads on data-intensive programs.
300% increase in component densities - Equals larger modules for next-generation performance demands.
20% decrease in power consumption - Less power consumed means less wasted resources to cool systems ...
Features: Anodized Black Aluminum fin heatsink cooling , generally used in heat treatment and the cooling IC and electronic component, for example: RAM, CPU Memory , GPU, Graphics Card, Vidoe Card,also can be used for cooling of , northbridge ,Southbridge ,motherboard, power transistor, FET, IC, power amplifier, Voltage Regulator,1W LED etc.
The fins increase the area of the board and thus provide for greater heat transfer.
Use heatsink adhesive glue to install heatsink on the IC.Glue is not included here.
Size is 28mm x 28mm x 11mm low profile , Please check the specification table and make sure that the size of the heatsink fits that of your component.
Specification
Product Name: Heatsink
Material: Aluminium
Color: Anodized Black
Overall Size: 28 x 28 x 11mm/1.10" x 1.10"x 0.43"(L*W*H)
Weight: 5...