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High Performance Gold Thermal Grease CPU Heatsink Compound Paste Syringe
- Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.05W/m.k, Thermal Resistance: <0.073°c-in2/w
- 20% metal oxide compounds
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Overview
Specs
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Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
Weight: 1.0 g/tube
Operation Temperature: -50/180°c
Thermal Conductivity: > 3.05W /m. k, Thermal
Resistance: <0.073°c-in2/w
20% metal oxide compounds
Weight: 1.0 g/tube
Operation Temperature: -50/180°c
Thermal Conductivity: > 3.05W /m. k, Thermal
Resistance: <0.073°c-in2/w
20% metal oxide compounds
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: non-replaceable
- This item is covered by JacobsParts Return Policy
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