Product Specs:
Technology: DDR3
SO-DIMM Density: 2GB (2048MB) per module
RoHS: Yes Comp.
Count: 16
Depth: 256Mb
Width: x64
Pin Count: 204-pin Op. Temp.: 0C to +85C
Data Rate: DDR3-1333
Speed: PC3-10600
CL: CAS 9-9-9-24
Cycle Time: 1.875 ns
Voltage: 1.5V Comp.
Config: 128Meg x 8
ECC: Non
ECC Module Ranks: Dual
Rank Register: Non Parity Low Noise 8-Layer PCB Meets and/or Exceeds Apple/Intel Specifications Fully Compliant with JEDEC specifications RoHS Certified