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    Minus Pad High Compression - 120x100x5.0mm 2-Pack Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & High Compressibility for SSDs, GPUs & Electronics

    • ULTRA-HIGH COMPRESSION: Adapts seamlessly to varying component heights, ensuring optimal thermal contact across diverse hardware surfaces.
    • VERSATILE APPLICATION: Ideal for GPUs, VRAM, VRMs, SSDs, and notebooks, accommodating multiple components with a single pad thickness.
    • ELECTRICALLY INSULATING: Provides safe usage on sensitive electronics, preventing short circuits and ensuring component protection.
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    HIGH THERMAL CONDUCTIVITY: Delivers efficient heat transfer, maintaining optimal operating temperatures for high-performance components.
    SINGLE THICKNESS SOLUTION: Eliminates the need for multiple pad sizes, simplifying installation and reducing inventory requirements.

    Minus Pad High Compression
    Highly compressible thermal pads for versatile applications
    The Minus Pad High Compression pads offer excellent compressibility and thermal conductivity. Ideal for GPU water cooling conversions, one size/thickness can be used at multiple contact points.
    One thermal pad for multiple components
    A single pad can cover VRAM, power stages, and other surfaces, even when the exact distance to the cooler is unknown. Offers comparable performance to Minus Pad Advance.
    Available in various thicknesses
    Each available in 120 x 100 mm and thicknesses of 1.0 mm, 2.0 mm, 3.0 mm, 4.0 mm, 5.0 mm to suit all needs.

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