Thermal Conductive Heatsink Plaster Silicone Grease Adhesive Cooling Paste Compound Glue for 3D Printer

Thermal Conductive Heatsink Plaster Silicone Grease Adhesive Cooling Paste Compound Glue for 3D Printer

Features:

1. It has good conductivity and wide service temperature range(-60~200?), short term 300? high temperature.

2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free.

3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.

4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.

Specifications:

Product weight: 5g

Quantity: 1pc, 5pcs

Heat conductive adhesive :white paste

Thermal conductivity >0.671W/m.k

Breaking strength 1.5MPA

Surface vulcanization time 10MIN /25?

Application: directly bonded solid components, LED and heat dissipation devices, etc.

Use for : Chip, , Memory, North bridge, South bridge, VGA card, Other heat dissipation part

Operation Manual:

1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again.

2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.

3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.

4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting.

Note: