UPSIREN U6 PRO 20g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~12 mm.

UPSIREN U6 PRO 20g is built for devices that push serious heat through very compact cooling systems. It forms a conformable, cohesive bridge between components and thin heat sinkscommon in gaming laptops and slim console revisionsdelivering efficient heat transfer where soft pads can miss contact. With 12.8 W/m·K* thermal conductivity and electrical nonconductivity, it focuses on the components most likely to throttle: GDDR6 VRAMs, power stages, and display/IO controllers.

Packaging advantage 20 g jar: generous capacity for full system refreshes and small fleets while remaining easy to handle and decant; reseals cleanly between sessions to preserve texture and cleanliness.

The compound is soft and just sticky enough to stay where you place it, yet it spreads smoothly to even out height differences. Even first time users can achieve neat, uniform layers: apply a thin film, build to ~12 mm total thickness, and check for a light imprint on reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research cofunded by Greece and the European Union.

Packet includes:

1 × 20 g jar of UPSIREN U6 PRO thermal putty

1 × plastic spatula

2 × protective finger sleeves

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).