UPSIREN U6 PRO 100g jar High-capacity thermal putty for thin heat sinks; 12.8 W/m·K*; nonconductive soft, lightly tacky compound optimized for ~12 mm layers on GDDR6 VRAMs, VRM , controller chips

UPSIREN U6 PRO 100g is a high-capacity jar for labs, refurbishers and power users who service compact cooling solutions at scale. It delivers a conformable, cohesive heat path between components and thin heat sinksexactly what modern gaming laptops and space-constrained systems demand. With 12.8 W/m·K* conductivity and electrical nonconductivity, it targets heat-dense areas like GDDR6 VRAMs and power stages to stabilize temperatures under sustained load.

Packaging advantage 100 g jar: bulk value without compromising handling; decant small portions for microscope work, keep the main jar sealed to preserve texture, and reduce reorders on long projects.

The compound is soft and just sticky enough to stay put, yet smooth enough to spread evenly and level out minor height differences. Even amateur users can achieve clean, uniform interfaces by applying a thin film and building to ~12 mm total thickness before reassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research co-funded by Greece and the European Union.

Packet includes:

1 × 100 g jar of UPSIREN U6 PRO thermal putty

1 × plastic spatula

2 × protective finger sleeves

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).