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the HT10000 Thermal Putty is precured one component, made of cross-linked silicone /ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage(10.0 W/mK)
One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers combine the benefits of thermal grease and gap pads, offering shape recovery, strong cohesion, long-term stability, low thermal resistance, and effective gap filling. They are a hybrid between liquid and solid
Typical Applications: Consumer electronics,Telecommunications equipment, Automotive electronics, Power supplies & semiconductors,Memory & power modules,Power electronics
Features: High thermal performance,Low contact resistance,Easily dispensable and reworkable, High compressibility for low stress applications,Reliable thermal performance, No pump out and cracking risk
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