Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: 10 pcs of 8.8x8.8x5mm aluminum heat sinks with 3M 8810 Heat transfer Peel and Stick Tape
Widely use for 3D Printer A4988 chipset,computer PC chipset, power IC, power electric device, LED light devices,Raspberry Pi,Banan Pi, Orange Pi,etc.
Come with 3M 8810, is a tacky pressure sensitive adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface.
The specialized chemistry of 3M 8810 renders the tape modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface
Excellent adhesive performance with good wetting and flow onto many substrate surfaces....