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Thermal Compound / Grease
Search Results: "UCSS-U-CCE-PR3-1"
Thermal Compound / Grease
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UPSIREN U6 PRO 50g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky compound for tight layouts; ideal layer thickness ~12 mm; targets GDDR6 VRAMs
Model #:
UPSIREN U6 PRO 50g
$
51
.00
–
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UPSIREN U6 PRO 100g jar High-capacity thermal putty for thin heat sinks; 12.8 W/m·K*; nonconductive soft, lightly tacky compound optimized for ~12 mm layers on GDDR6 VRAMs, VRM , controller chips
Model #:
U6_100g
$
59
.99
–
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UPSIREN UX PRO Ultra 50g jar High-viscosity nonconductive thermal putty for 24 mm gaps. Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*.
Model #:
UX_50g
$107.00
$
89
.99
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$17.01
(15%)
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UPSIREN U6 PRO Thermal Putty For VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance 50 g
Model #:
DRG-U6 PRO-50g
$
38
.99
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(3)
UPSIREN UTP-8 Thermal Putty For VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance 20 g
Volume / Net Weight:
20g
Thermal Conductivity:
14.8W/mk
Long Term Operating Temperature:
-55 to 200 C
Features:
non-conducting
Model #:
DR-UTP-8-20G
$
21
.99
–
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