Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Specifications: Color: Black
Material: EPOM
Dimension: 530 mm(W) x 380 mm(L) x 4 mm (T)
Building a silent computer is often a difficult goal for enthusiasts and power users to achieve, especially if the computer needs to also be fast and cool. The SF01 is a package of two foam pads designed to help absorb noise with minimal impact inside a computer chassis. Each pad has large surface area and high density 4mm thick foam to provide good noise reduction and flexible integration choices