Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Specifications: Thermal Conductivity (W/mk): 8.5
Viscosity (poise): 870
Density (g/cm3): 2.5
Net Weight: 4g
The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer. The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components. The consistency of the ARCTIC MX-4 is designed for simple application. Its text...
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Specifications: The thermal conductivity of CTG10 thermal paste reaches 14.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into
Block Compatibility: Compatible with a wide range of M.2 SSDs, including NVMe and SATA interfaces. Designed specifically for 2280-size SSDs, and the 3mm adjustable height allows it to support one-sided and double-sided SSDs. Suitable for most mainstream SSD models, such as SAMSUNG PCIE 4.0 980Pro, 970Pro, SN850, TiPro7000, SPATIUM M480 PLAY, MP600,
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Part Number: Canned thermal paste has a unit price about 50% lower than syringe packaging, and is more recommended for large consumer groups such as physical stores, server fields, power battery fields, aerospace fields, etc.
Features: Product Description Aluminum IC heatsink for Router,power transistor, FET, IC, power amplifier, Voltage Regulator, MOSFET, SCR, etc.
Use heatsink adhesive glue to install heatsink on the IC.Glue is not included here.
Size is 14mm x 14mm x 10mm,Please check your componet careful, and make sure the size of the heatsink fits it no problem
Specification
Product Name: Heatsink
Material: Aluminium
Color: Silver Tone
Overall Size: 14 x 14 x 10mm/ 0.55" x 0.55" x 0.4" (L*W*H)
Weight: 55g
Package Content: 20pcs x Heatsink
Features: Product Description Aluminum IC heatsink for PC Chipset power transistor, FET, IC, power amplifier, Voltage Regulator,etc.
Use heatsink adhesive glue to install heatsink on the IC.Glue is not included here.
Please check the specification table and make sure that the size of the heatsink fits that of your component.
Specification
Product Name: Heatsink
Material: Aluminium
Color: Anodized Black
Overall Size: 25mm x 25mm x 5mm
Weight: 20g
Package Content: 5pcs x Heatsink
Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g
Specifications: Thermal Conductivity: 3.3 W/m-k
Dimension: 145 x 90 x 16 mm
Color: Gray
Weight: 4g
Shelf-Life: 24 months from DOM
Operating Temperature: -50 to 250 degree C
Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.