Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.
Long Term Operating Temperature: -100 °C to +250 °C
Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps (Viscosity)
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread card.
Specific Gravity: 2.7g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3