Thermal Compound / Grease

Limited time offer, ends 01/15

• Volume / Net Weight: 30g
• Thermal Conductivity: 5.6 W/mK
• Specifications: Thermal Conductivity: 5.6 W/(mK) Viscosity: 850 poise Density: 3.96 g/cm³ Volume Resistivity: 1.22 x 1012 O-cm
• Model #: ACTCP00003B

Limited time offer, ends 01/15

• Model #: mx5-8g

• Volume / Net Weight: 1.0g
• Thermal Conductivity: 73 W/mK
• Long Term Operating Temperature: 10 °C / +140 °C
• Features: Thermal Conductivity: 73 W/mk Consistency: Liquid Viscosity: 0,0021 Pas Density: 6,24g/cm3 Recommended Temperature: 10 °C / +140 °C
• Model #:

• Volume / Net Weight: 3.5g
• Long Term Operating Temperature: -30~150
• Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
• Model #: GC-4-3.5g

• Model #: CE-001 Combo

• Model #: KRYO33

Limited time offer, ends 01/15

• Model #: CERAMIQUE2-25G

• Model #: TG-MP8-1202005-2R

• Model #: TG-KS-50-50

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G