Recommend Use: AMD 300 Series / AMD 400 Series / AMD X570 / High Performance or Gaming Memory / Intel 100 Series / Intel 200 Series / Intel 300 Series / Intel 400 Series / Intel X299
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
CPU Type: Support Dual AMD EPYC 7003* and 7002 Series Processors
*A BIOS update is required to support AMD EPYC 7003 Series Processors. Please contact ASRock Rack Technical Support for the necessary firmwares.
Memory Slots: 32 x 288Pin
Max Memory Supported: Max. Capacity per DIMM
- RDIMM: up to 64GB
- LRDIMM: up to 256GB