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Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the
Specifications: Renowned premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink; more than 150 awards and recommendations
Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Part Number: Canned thermal paste has a unit price about 50% lower than syringe packaging, and is more recommended for large consumer groups such as physical stores, server fields, power battery fields, aerospace fields, etc.
Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Specifications: Thermal Conductivity (W/mk): 8.5Viscosity (poise): 870Density (g/cm3): 2.5Net Weight: 8gThe ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components.The consistency of the ARCTIC MX-4 is designed for simple application. Its texture is just thin enough to spread onto components using fingers without creating much mess....