Thermal paste description: High efficiency paste with excellent thermal conductivity, recommended for experienced users and systems where thermal conductivity is critical. Delivered in easy-to-apply syringe with 1.0 g paste. Thermal Conductivity of this product is 73 W/mk and thermal resistance of 0.0021 K/W.
Features: Convenient 1.0 gram syringe, making this thermal paste very easy to apply Delivers optimal heat transfer for larger-scale cooling systems Designed for applications where heat dissipation is of critical importance Popular choice for very experience PC builders Thermal conductivity 73 W/mk
-Type: Industrial Computer Accessories. -Model
Number: 3770K 4790K 6700K E3-1230 7700K 8700K 115x. -All alloy metal materials, surface spray processing, hard and not easy break, can completely replace bench vice, suitable intel 115x series CPU opener ( seven generations U Such as 7700K); Intel 2 generation, 2011 interface.
CPU cap opener description: Why need to open the cap? The top cap of the CPU is connected to the wafer by a layer of grease. It is this grease that causes the CPU to dissipate heat. Therefore, the CPU temperature is lowered by opening the cap.
1. There is a certain risk in opening the cover itself, and the Intel warranty cannot be obtained after opening the cover. If have problems, the company cannot take responsibility.
2. When using this product, do not put paper under the PCB, it may make the PCB height too high, causing the screw to scratch the top cover and the slider damage PCB.
1. Put the CPU into the opener
2. Insert and twist the screw
3. Wipe the silicone and CPU
Note: 704 Silicon Rubber is not included now!