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Thermopad Thermal Grizzly Minus Pad 8 120x20x1.5mm- Silicone, Self-Adhesive, Thermally Conductive Thermal Pad - Conducts Heat and Cools The Heating Elements of The Computer or Console
- Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
- Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
- The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
- Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
- Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate
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Overview
Specs
Reviews
Thermal Grizzly has been a leading manufacturer of cooling components for computers and consoles such as PS4, PS3, Xbox 360 and Xbox One X for years. The company's products are considered reliable and durable and have their fans all over the world.
High-performance thermal inserts from the Thermal Grizzly Minus Pad 8 series have a very flexible and flexible surface with very high thermal conductivity. Even the smallest differences in components can be compensated very well. Available in various sizes and thicknesses.
Thermopad Thermal Grizzly Minus Pad 8 is a perfect solution for beginners who want to provide great thermal conductivity and optimize the operation of their cooling systems. After the first use, you can immediately see a significant drop in temperature, but not only. You'll also notice a significant drop in volume. The thermal pad from Thermal Grizzly offers excellent compatibility with both air and liquid cooling systems. At the same time, it guarantees the absence of electrical conductivity and resistance to the passage of time, without hardening or loss of properties.
Grizzly Thermal Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C/+250 °C, it is perfect for configurations supporting extremely demanding applications, which makes it an ideal solution also for industrial environments. and at the same time protects the contact surfaces, preventing the formation of micro-cracks. It is ideal for water cooling and for components that will be subject to OC.
Munus Pad 8 is characterized by high compressibility and flexibility as well as dielectric properties.
After removing the Minus Pad 8 thermally conductive mat, there were significantly less scratches on the surfaces of the lubricated elements. Application of motherboard chipset, memory modules, graphics card memory, graphics card GPU, notebooks.
High-performance thermal inserts from the Thermal Grizzly Minus Pad 8 series have a very flexible and flexible surface with very high thermal conductivity. Even the smallest differences in components can be compensated very well. Available in various sizes and thicknesses.
Thermopad Thermal Grizzly Minus Pad 8 is a perfect solution for beginners who want to provide great thermal conductivity and optimize the operation of their cooling systems. After the first use, you can immediately see a significant drop in temperature, but not only. You'll also notice a significant drop in volume. The thermal pad from Thermal Grizzly offers excellent compatibility with both air and liquid cooling systems. At the same time, it guarantees the absence of electrical conductivity and resistance to the passage of time, without hardening or loss of properties.
Grizzly Thermal Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C/+250 °C, it is perfect for configurations supporting extremely demanding applications, which makes it an ideal solution also for industrial environments. and at the same time protects the contact surfaces, preventing the formation of micro-cracks. It is ideal for water cooling and for components that will be subject to OC.
Munus Pad 8 is characterized by high compressibility and flexibility as well as dielectric properties.
After removing the Minus Pad 8 thermally conductive mat, there were significantly less scratches on the surfaces of the lubricated elements. Application of motherboard chipset, memory modules, graphics card memory, graphics card GPU, notebooks.
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