Features: K2 PRO SPECIFICATIONS:
Printing Technology: Fused Deposition Modeling
Build Volume: 300 x 300 x 300 mm
Printing Speed: Max 600 mm/s
Acceleration: Max 20000 mm/s2
Printing Accuracy: 100±0.1 mm
Layer Height: 0.05-0.3 mm
Extruder: Dual-gear direct drive extruder
Filament Diameter: 1.75 mm
Nozzle Diameter: 0.4 mm
Nozzle Temperature: Max 300 °C
Heatbed Temperature: Max 110 °C
Chamber Temperature: Max 60°C
Build Plate: Flexible PEI build plate
Leveling Mode: Full-auto leveling
XYE Motor: Step-servo motors for XY axis and extruder
File Transfer: USB Drive/Ethernet/WiFi
File Storage: 32GB EMMC
RFID Sensor Printer: Included
Rated Voltage: 100-240V ~ AC 50/60 Hz
Display Screen: 4" color touch screen
Rated Power: 1300W
Supported Filaments: PLA...
Memory Standard: Supports DDR5 7200+(OC)/7000(OC)/6800(OC)/6600(OC)/ 6400(OC)/6200(OC)/6000(OC)/5800(OC)/5600/5400/5200/5000/4800, Un-buffered Memory*
Supports Intel® Extreme Memory Profile (XMP)
OptiMem II
* Supported memory types, data rate(Speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information refer to www.asus.com for memory support list.
* Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.
Number of Memory Slots: 4 x DIMM, Max. 128GB, DDR5 7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/6000(OC)/5800(OC)/5600/5400/5200/5000/4800, Un-buffered Memory*
Dual Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
OptiMem II
* Supported memory types, data rate(Speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information refer...